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18/01/2016

EE6007 MICRO ELECTRO MECHANICAL SYSTEMS-Anna University(Free Download Notes)

EE6007     MICRO  ELECTRO MECHANICAL  SYSTEMS                  L T  P  C 3   0 0  3
OBJECTIVES
•    To provide knowledge of semiconductors and solid mechanics to fabricate MEMS devices.
•     To educate on the rudiments of Micro fabrication techniques.
•    To introduce various sensors and actuators
•    To introduce different materials used for MEMS
To educate on the applications of MEMS to disciplines beyond Electrical and Mechanical engineering.


UNIT I             INTRODUCTION                                                                                                         9
Intrinsic Characteristics of MEMS – Energy Domains and Transducers- Sensors and Actuators – Introduction to Micro fabrication - Silicon based MEMS processes – New Materials – Review of Electrical and Mechanical concepts in MEMS – Semiconductor devices – Stress and strain analysis – Flexural beam bending- Torsional deflection.

UNIT II            SENSORS AND ACTUATORS-I                                                                               9
Electrostatic sensors – Parallel plate capacitors – Applications – Interdigitated Finger capacitor – Comb drive devices – Micro Grippers – Micro Motors - Thermal Sensing and Actuation – Thermal expansion – Thermal couples – Thermal resistors – Thermal Bimorph - Applications – Magnetic Actuators – Micromagnetic components – Case studies of MEMS in magnetic actuators- Actuation using Shape Memory Alloys

UNIT III           SENSORS AND ACTUATORS-II                                                                              9
Piezoresistive sensors – Piezoresistive sensor materials - Stress analysis of mechanical elements – Applications to Inertia, Pressure, Tactile and Flow sensors – Piezoelectric sensors and actuators – piezoelectric effects – piezoelectric materials – Applications to Inertia , Acoustic, Tactile and Flow sensors.

UNIT IV          MICROMACHINING                                                                                                   9
Silicon Anisotropic Etching – Anisotrophic Wet Etching – Dry Etching of Silicon – Plasma Etching – Deep Reaction Ion Etching (DRIE) – Isotropic Wet Etching – Gas Phase Etchants – Case studies - Basic surface micro machining processes – Structural and Sacrificial Materials – Acceleration of sacrificial Etch – Striction and Antistriction methods – LIGA Process - Assembly of 3D MEMS – Foundry process.

UNIT V           POLYMER AND OPTICAL MEMS                                                                            9
Polymers in MEMS– Polimide - SU-8 - Liquid Crystal Polymer (LCP) – PDMS – PMMA – Parylene – Fluorocarbon - Application to Acceleration, Pressure, Flow and Tactile sensors- Optical MEMS – Lenses and Mirrors – Actuators for Active Optical MEMS.


OUTCOMES

TOTAL : 45 PERIODS

Ability to understand and apply basic science, circuit theory, Electro-magnetic field theory control  theory and apply them to electrical engineering problems.
•           Ability to understand and analyse, linear and digital electronic  circuits.

TEXT BOOKS:
1.        Chang Liu, "Foundations of MEMS", Pearson Education Inc., 2006.
2.        Stephen D Senturia, "Microsystem Design", Springer Publication, 2000.
3.        Tai Ran Hsu, “MEMS & Micro systems Design and Manufacture” Tata McGraw Hill, New
Delhi, 2002.

REFERENCES:
1.        Nadim Maluf,“ An Introduction to Micro Electro Mechanical System Design”, Artech House,
2000.
2.        Mohamed Gad-el-Hak, editor, “ The MEMS Handbook”, CRC press Baco Raton, 2000
3.        Julian w. Gardner, Vijay K. Varadan, Osama O. Awadelkarim, "Micro Sensors MEMS and
Smart Devices", John Wiley & Son LTD,2002
4.        James J.Allen, "Micro Electro Mechanical System Design", CRC Press Publisher, 2010
5.        Thomas M.Adams and Richard A.Layton, “Introduction MEMS, Fabrication and Application,” Springer 2012.